Process analysis of via hole plugging of printed circuit board PCB

Via (VIA), the copper foil circuit between the conductive patterns in different layers of the circuit board is conducted or connected by this kind of hole, but it cannot be inserted into the component lead or the copper-plated hole of other reinforcing materials. The printed circuit board (PCB) is formed by the accumulation of many layers of copper foil. The copper foil layers cannot communicate with each other because each layer of copper foil is covered with an insulating layer, so they need to rely on vias for signal linking, so there is a Chinese via Title.

Via (VIA), the copper foil circuit between the conductive patterns in different layers of the circuit board is conducted or connected by this kind of hole, but it cannot be inserted into the component lead or the copper-plated hole of other reinforcing materials. The printed circuit board (PCB) is formed by the accumulation of many layers of copper foil. The copper foil layers cannot communicate with each other because each layer of copper foil is covered with an insulating layer, so they need to rely on vias for signal linking, so there is a Chinese via Title.

The via hole of the circuit board must pass through the plug hole to meet the customer’s needs. In changing the traditional aluminum plug hole process, the circuit board surface solder mask and plug hole are completed by white mesh, so that the production is more stable and the quality is more reliable. , It is more perfect to use. Vias help circuits to connect and conduct each other. With the rapid development of the electronics industry, higher requirements are placed on the manufacturing process and surface mount technology of printed circuit boards (PCBs).
 

Process analysis of via hole plugging of printed circuit board PCB

The plugging process of via holes came into being, and the following requirements must be met at the same time:

1. There is only copper in the hole, and the solder mask can be plugged or not plugged;

2. There must be tin-lead in the hole, with a certain thickness requirement (4um), to avoid solder mask ink entering the hole, causing tin beads to be hidden in the hole;

3. The through holes must have solder mask ink plug holes, opaque, no tin rings and tin beads, and must be flat.

Blind hole is to connect the outermost circuit in the printed circuit board (PCB) with the adjacent inner layer with electroplated holes. Since the opposite side cannot be seen, it is called blind pass. In order to increase the space utilization between the board circuit layers, blind holes come in handy. The blind hole is a via hole to the surface of the printed board.

Blind holes are located on the top and bottom surfaces of the circuit board and have a certain depth. They are used to connect the surface line with the underlying inner line. The depth of the hole generally has a specified ratio (aperture). This production method requires special attention. The drilling depth must be just right. If you don’t pay attention, it will cause difficulties in electroplating in the hole. Therefore, few factories will adopt this production method. In fact, it is possible to drill holes for the circuit layers that need to be connected in advance in the individual circuit layers, and then glue them together, but more precise positioning and alignment devices are required.

Buried vias are connections between any circuit layers inside a printed circuit board (PCB), but they are not connected to the outer layer, that is, they do not mean a via hole extending to the surface of the circuit board.

This manufacturing process cannot be achieved by drilling after the circuit board is bonded. It must be drilled at the time of individual circuit layers, first partially bonding the inner layer, then electroplating, and finally bonding all. Since the operation process is more laborious than the original vias and blind holes, the price is also the most expensive. This manufacturing process is usually only used for high-density circuit boards to increase the space utilization of other circuit layers.

In the printed circuit board (PCB) production process, drilling is very important. A simple understanding of drilling is to drill the required vias on the copper clad board, which has the function of providing electrical connections and fixing devices. If the operation is incorrect and causes problems in the via process, the device cannot be fixed on the circuit board, which will affect the use of the circuit board, and at the worst, the entire board will be scrapped. Therefore, the drilling process is very important.

The Links:   BSM300GB60DLC AT080TN52-V5

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